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eda-architect

@l3wi/claude-eda
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Electronics project architecture and constraint definition. Guides users through defining project requirements, power systems, interfaces, and physical constraints.

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SKILL.md

name eda-architect
description Electronics project architecture and constraint definition. Guides users through defining project requirements, power systems, interfaces, and physical constraints.
allowed-tools Read, Write, WebSearch, Glob

EDA Architect Skill

Define the architecture and constraints for electronics projects.

Auto-Activation Triggers

This skill activates when:

  • User asks to "design a board", "create a project", "start a new PCB"
  • User asks "what do I need for..." an electronics project
  • Project has no docs/project-spec.md or docs/design-constraints.json
  • User mentions requirements gathering or project planning

Context Requirements

Requires: Nothing (this is the first step)

Produces:

  • docs/project-spec.md - Human-readable specification
  • docs/design-constraints.json - Machine-readable constraints

Workflow

1. Understand the Project Goal

Ask the user about:

  • What is this device/board intended to do?
  • Target use case (prototype, production, hobby)?
  • Any existing designs to reference?

2. Define Power Architecture

Determine:

  • Input power source (USB, battery, mains, PoE, solar)
  • Voltage rails needed (3.3V, 5V, 12V, etc.)
  • Power topology per rail: LDO vs buck converter
    • See reference/POWER-TOPOLOGY-DECISION.md for decision tree
  • Estimated power budget
  • Battery life requirements if applicable

2.5 Thermal Budget

Estimate early:

  • Total power dissipation (sum of all consumers)
  • Hot components (any >0.5W needs attention)
  • Cooling strategy: natural, forced, heatsink
  • See reference/THERMAL-BUDGET.md for estimation guide

3. Processing Requirements

Establish:

  • MCU/processor needs (or if needed at all)
  • Processing requirements (speed, peripherals)
  • Memory requirements (Flash, RAM)
  • Preferred families (STM32, ESP32, RP2040, etc.)

4. Connectivity & Interfaces

Document:

  • Wireless: WiFi, Bluetooth, LoRa, Zigbee, cellular
  • Wired: Ethernet, USB, CAN, RS485, RS232
  • User interfaces: buttons, LEDs, displays
  • Debug/programming interfaces

4.5 Stackup Decision

Determine layer count based on complexity:

  • 2-layer: Simple, LDO only, low-speed (I2C/SPI)
  • 4-layer: MCU with switching regulator, USB, Ethernet, WiFi
  • 6-layer: High-speed (>100MHz), DDR, dense routing
  • See reference/LAYER-COUNT-DECISION.md for decision tree

5. Sensors & I/O

List:

  • Required sensors
  • Analog inputs/outputs
  • Digital I/O requirements
  • Any specialized interfaces (motor control, etc.)

6. Physical Constraints

Define:

  • Target board dimensions
  • Enclosure requirements
  • Mounting hole positions
  • Connector placement constraints
  • Height restrictions

7. Environmental

Note:

  • Operating temperature range
  • Indoor/outdoor use
  • IP rating if applicable

8. Manufacturing Targets

Capture:

  • Target quantity
  • Assembly method (hand, reflow, turnkey)
  • Layer count preference
  • Budget constraints

8.5 DFM Early Constraints

Capture manufacturer capabilities:

  • Preferred manufacturer (JLCPCB, PCBWay, OSHPark)
  • Assembly method constraints
  • Fine-pitch components (affects hand soldering)
  • Budget tier: prototype, low-volume, production

Output Format

project-spec.md Structure

# Project Specification: [Name]

## Overview
[Brief description and goals]

## Requirements Summary
| Category | Requirement |
|----------|-------------|
| Power Input | ... |
| Voltage Rails | ... |
| MCU | ... |
| Connectivity | ... |

## Detailed Requirements
[Sections for each category with full details]

## Constraints
[Physical, environmental, budget constraints]

## Open Questions
[Any unresolved items]

design-constraints.json Schema

See reference/CONSTRAINT-SCHEMA.md for full schema documentation.

Guidelines

  • Ask clarifying questions rather than assuming
  • Suggest common solutions when user is unsure
  • Flag potential issues early (power budget, space constraints)
  • Keep the spec focused - avoid scope creep
  • Document rationale for key decisions
  • Use project templates from reference/PROJECT-TEMPLATES.md as starting points

Architecture Validation Warnings

Before completing the architecture phase, check for these risky combinations:

Condition Warning
2-layer + switching regulator "Consider 4-layer - switching regulators need solid ground plane"
2-layer + USB/Ethernet "Controlled impedance difficult on 2-layer - consider 4-layer"
>2W total + no thermal plan "Add thermal budget - high power needs planning"
Hand assembly + fine-pitch (<0.5mm) "Verify solderability - fine-pitch is difficult to hand solder"
>0.5W component + no thermal strategy "Component dissipating >0.5W needs thermal attention"
Battery + LDO with high Vin-Vout "Consider buck converter for battery life"

When a warning condition is detected, present it to the user and ask if they want to:

  1. Update the design to address it
  2. Acknowledge the risk and proceed

Next Steps

After completing architecture, suggest:

  1. /eda-source [component-role] to begin component selection
  2. Start with critical components: MCU, power regulators